Title :
DC and RF performance of LP-MOCVD grown Al/sub 0.25/Ga/sub 0.75/As/In/sub x/Ga/sub 1-x/As (x=0.15-0.28) P-HEMT´s with Si-delta doped GaAs layer
Author :
Young-Jin Jeon ; Yoon-Ha Jeong ; Bumman Kim ; Young-Gi Kim ; Won-Pyo Hong ; Myung-Sung Lee
Author_Institution :
Dept. of Electron. & Electr. Eng., Pohang Uni. of Sci. & Technol., South Korea
Abstract :
Si-delta-doped Al/sub 0.25/Ga/sub 0.75/As/In/sub x/Ga/sub 1-x/As (x=0.15-0.28) P-HEMT´s, prepared by LP-MOCVD, are investigated. The large conduction band discontinuity leads to 2-DEG density as high as 2.1×10/sup 12//cm2 with an electron mobility of 7300 cm2/V/spl middot/s at 300 K. The P-HEMT´s with 0.7×60 μm gate have a maximum extrinsic transconductance of 380 mS/mm, and a maximum current density of 300 mA/mm. The S-parameter measurements indicate that the current gain and power gain cutoff frequencies are 30 and 61 GHz, respectively, The RF noise characteristics exhibit a minimum noise figure of 1.2 dB with an associated gain of 10 dB at 10 GHz. Due to the efficient doping technique, the electron mobility and transconductance obtained are among the best reported for MOCVD grown P-HEMT´s with the similar structure.
Keywords :
III-V semiconductors; S-parameters; aluminium compounds; doping profiles; electron mobility; gallium arsenide; high electron mobility transistors; indium compounds; microwave field effect transistors; semiconductor device noise; semiconductor doping; silicon; two-dimensional electron gas; vapour phase epitaxial growth; 0.7 micron; 1.2 dB; 10 dB; 10 to 61 GHz; 2DEG density; 380 mS/mm; Al/sub 0.25/Ga/sub 0.75/As-InGaAs; DC performance; GaAs:Si; LP-MOCVD grown PHEMT; RF noise characteristics; RF performance; S-parameter measurements; Si-delta doped GaAs layer; conduction band discontinuity; electron mobility; pseudomorphic HEMT; transconductance; Current density; Current measurement; Electron mobility; Frequency measurement; Gain measurement; Noise figure; Power measurement; Radio frequency; Scattering parameters; Transconductance;
Journal_Title :
Electron Device Letters, IEEE