• DocumentCode
    1075373
  • Title

    Ceramic processing of YBa/sub 2/Cu/sub 3/O/sub x/ based high-T/sub c/ superconductors

  • Author

    Yan, Man F. ; Ling, Hung C. ; O´Bryan, Henry M. ; Gallagher, Patrick K. ; Rhodes, Warren W.

  • Author_Institution
    AT&T Bell Lab., Murray Hill, NJ, USA
  • Volume
    11
  • Issue
    4
  • fYear
    1988
  • Firstpage
    401
  • Lastpage
    406
  • Abstract
    Ceramic processing of YBa/sub 2/Cu/sub 3/O/sub x/ based superconductors and process-related problems are described. Conditions for calcination, sintering, and microstructural development are important considerations for the superconducting properties. The authors examine different forming techniques to prepare superconducting components with different sizes, shapes, and configurations. They also identify and discuss five problem areas related to: (1) incomplete decomposition of BaCO/sub 3/ precursor; (2) oxidation of YBa/sub 2/Cu/sub 3/O/sub x/ ceramics; (3) sensitivity of the YBa/sub 2/Cu/sub 3/O/sub x/ phase to water; (4) reactivity of the YBa/sub 2/Cu/sub 3/O/sub x/ phase with substrates and co-firing materials; and (5) low critical current density in bulk ceramics of YBa/sub 2/Cu/sub 3/O/sub x/.<>
  • Keywords
    barium compounds; ceramics; critical current density (superconductivity); heat treatment; high-temperature superconductors; oxidation; sintering; yttrium compounds; YBa/sub 2/Cu/sub 3/O/sub x/; calcination; co-firing materials; forming techniques; high-temperature superconductors; incomplete decomposition; low critical current density; microstructural development; oxidation; reactivity; sintering; superconducting properties; water; Calcination; Ceramics; Conducting materials; Powders; Superconducting epitaxial layers; Superconducting filaments and wires; Superconducting films; Superconducting integrated circuits; Superconducting transition temperature; Superconductivity;
  • fLanguage
    English
  • Journal_Title
    Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0148-6411
  • Type

    jour

  • DOI
    10.1109/33.16674
  • Filename
    16674