Title :
Large magnetoresistance at high bias voltage in double magnetic tunnel junctions
Author :
Colis, Silviu ; Gieres, Günter ; Dimopoulos, Theodoros ; Bär, Ludwig ; Wecker, Joachim
Author_Institution :
Corporate Technol., Siemens AG, Erlangen, Germany
fDate :
7/1/2004 12:00:00 AM
Abstract :
This paper reports on the magnetic and transport properties of [IrMn/CoFe]/AlOx/SL/AlOx/[CoFe/IrMn] double magnetic tunnel junctions (DMTJ) deposited by magnetron sputtering and patterned using optical lithography. The aim is to obtain a high-quality magnetoresistive hard-soft system presenting a large magnetoresistance at a high applied bias voltage. For this purpose, two DMTJ were studied where the soft layer (SL) was CoFe1/NiFe5/CoFe1 (nm) and NiFe7 (nm). The similar quality of both AlOx barriers within each sample is supported by the symmetric character of the tunnel magnetoresistance (TMR) versus the bias voltage variation. The junctions having a CoFe/NiFe/CoFe (NiFe) SL show a resistance-area product (RAP) about 35 (19) k Ω·μm2, a high TMR at room temperature of 49 (20)%, and a high bias voltage at which the TMR signal is decreased to half of its maximum value, V12/=1.33(1.0) V. Both hard magnetic layers are rigid in negative field up to 51.5 kA/m, while the coercive field of the SL is around 1.16 and 0.48 kA/m for the DMTJ integrating, respectively, the CoFe/NiFe/CoFe and NiFe SL. The large difference of coercive fields associated with the low dependence of the TMR versus bias voltage, recommend this systems for spin electronic devices.
Keywords :
amorphous magnetic materials; lithography; magnetic tunnelling; manganese alloys; sputtering; tunnelling magnetoresistance; AlO; IrMn-CoFe; NiFe5-CoFe; NiFeT; TMR versus bias voltage; bias dependence; bias voltage variation; coercive field; double magnetic tunnel junctions; double tunnel junction; high bias voltage; large magnetoresistance; magnetic properties; magnetoresistive hard-soft system; magnetron sputtering; optical lithography; resistance-area product; soft layer; spin electronic devices; tunnel magnetoresistance; Electrodes; Lithography; Magnetic properties; Magnetic separation; Magnetic tunneling; Sputtering; Stereolithography; Temperature dependence; Tunneling magnetoresistance; Voltage; Bias dependence; TMR; double tunnel junction; tunnel magnetoresistance;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.2004.830426