DocumentCode :
107630
Title :
Superconducting Noncontact Device for Precision Positioning in Cryogenic Environments
Author :
Perez-Diaz, J.L. ; Valiente-Blanco, I. ; Diez-Jimenez, E. ; Sanchez-Garcia-Casarrubios, J.
Author_Institution :
Dept. de Ing. Mec., Univ. Carlos III de Madrid, Leganés, Spain
Volume :
19
Issue :
2
fYear :
2014
fDate :
Apr-14
Firstpage :
598
Lastpage :
605
Abstract :
In this paper, a noncontact linear positioner based on superconducting magnetic levitation for high-precision positioning has been tested under cryogenic conditions (~20 K and ~10 -6Pa). The prototype is able to achieve submicrometric positioning resolution of 230 ± 30 nm RMS along a stroke of ±9 mm length with a current resolution of 15 μA, and a peak current requirement lower than ±500 mA. In addition, it was demonstrated that an open-loop control strategy could be used for positioning the moving part with the accuracy of the order of 1 μm. On the other hand, deviations of the slider position were found to be ±650 μrad for the pitch, lower than 100 μrad for the yaw, ±2000 μrad for the roll, and ±4 μm for the lateral run, all of them related to a full stroke motion. These results reveal a good performance of the device and demonstrate the potential of a new tool for applications, where high-precision positioning is required within a long range in cryogenic environments like far-infrared interferometry.
Keywords :
cryogenic electronics; magnetic levitation; open loop systems; position control; superconducting devices; RMS; cryogenic environments; current -15 muA; far-infrared interferometry; full stroke motion; high-precision positioning; lateral run; noncontact linear positioner; open-loop control strategy; size -9 mm; size 9 mm; slider position; submicrometric positioning resolution; superconducting magnetic levitation; superconducting noncontact device; Cryogenics; interferometry; levitation; submicrometric positioning; superconducting device;
fLanguage :
English
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
Publisher :
ieee
ISSN :
1083-4435
Type :
jour
DOI :
10.1109/TMECH.2013.2250988
Filename :
6487405
Link To Document :
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