Title :
Electromigration Resistant Power Delivery Systems
Author :
Sekar, Deepak C. ; Dang, Bing ; Davis, Jeffrey A. ; Meindl, James D.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Abstract :
It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system.
Keywords :
electromigration; flip-chip devices; integrated circuit interconnections; microprocessor chips; power supply circuits; solders; electromigration resistant power delivery systems; electromigration time-to-failure; microprocessor; onchip global interconnects; solder bumps; Current density; Electromigration; Frequency; Integrated circuit interconnections; Microprocessors; Packaging; Power system interconnection; Sleep; Temperature; Wiring; Alternating current; electromigration (EM); flip-chip devices;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2007.902165
