• DocumentCode
    1077243
  • Title

    Electromigration Resistant Power Delivery Systems

  • Author

    Sekar, Deepak C. ; Dang, Bing ; Davis, Jeffrey A. ; Meindl, James D.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • Volume
    28
  • Issue
    8
  • fYear
    2007
  • Firstpage
    767
  • Lastpage
    769
  • Abstract
    It is well known that electromigration (EM) time-to-failure for ac is several orders of magnitude larger than for dc. We propose a novel technique that reverses current direction in the power delivery system of a microprocessor every time it is rebooted. This improves EM time-to-failure of solder bumps and on-chip global interconnects and vias in the power delivery system.
  • Keywords
    electromigration; flip-chip devices; integrated circuit interconnections; microprocessor chips; power supply circuits; solders; electromigration resistant power delivery systems; electromigration time-to-failure; microprocessor; onchip global interconnects; solder bumps; Current density; Electromigration; Frequency; Integrated circuit interconnections; Microprocessors; Packaging; Power system interconnection; Sleep; Temperature; Wiring; Alternating current; electromigration (EM); flip-chip devices;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2007.902165
  • Filename
    4278383
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1077243