DocumentCode
1077383
Title
Special issue on Compact Interconnect Models for Giga Scale Integration
Volume
30
Issue
2
fYear
2009
Firstpage
202
Lastpage
202
Abstract
Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers.
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2009.2013292
Filename
4757321
Link To Document