DocumentCode
1077647
Title
Special issue on Compact Interconnect Models for Giga Scale Integration
Volume
56
Issue
2
fYear
2009
Firstpage
360
Lastpage
360
Abstract
Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2013515
Filename
4757348
Link To Document