• DocumentCode
    1077647
  • Title

    Special issue on Compact Interconnect Models for Giga Scale Integration

  • Volume
    56
  • Issue
    2
  • fYear
    2009
  • Firstpage
    360
  • Lastpage
    360
  • Abstract
    Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2013515
  • Filename
    4757348