DocumentCode :
1077683
Title :
Coupling capacitances for two-dimensional wires
Author :
Dang, R.L.M. ; Shigyo, N.
Author_Institution :
TOSHIBA Corporation, Kawasaki-shi, Japan
Volume :
2
Issue :
8
fYear :
1981
fDate :
8/1/1981 12:00:00 AM
Firstpage :
196
Lastpage :
197
Abstract :
This letter reports some interesting results on the two-dimensional effects of the capacitances of LSI metallic interconnect wires, based on a numerical analysis of the Laplace´s equation. Our findings show that there exists an optimum condition for the relation between line-and-space and coupling capacitances.
Keywords :
Conductors; Delay effects; Insulation; Laplace equations; Large scale integration; MOSFETs; Numerical analysis; Parasitic capacitance; Problem-solving; Wires;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/EDL.1981.25399
Filename :
1481883
Link To Document :
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