Title :
Coupling capacitances for two-dimensional wires
Author :
Dang, R.L.M. ; Shigyo, N.
Author_Institution :
TOSHIBA Corporation, Kawasaki-shi, Japan
fDate :
8/1/1981 12:00:00 AM
Abstract :
This letter reports some interesting results on the two-dimensional effects of the capacitances of LSI metallic interconnect wires, based on a numerical analysis of the Laplace´s equation. Our findings show that there exists an optimum condition for the relation between line-and-space and coupling capacitances.
Keywords :
Conductors; Delay effects; Insulation; Laplace equations; Large scale integration; MOSFETs; Numerical analysis; Parasitic capacitance; Problem-solving; Wires;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/EDL.1981.25399