• DocumentCode
    1077683
  • Title

    Coupling capacitances for two-dimensional wires

  • Author

    Dang, R.L.M. ; Shigyo, N.

  • Author_Institution
    TOSHIBA Corporation, Kawasaki-shi, Japan
  • Volume
    2
  • Issue
    8
  • fYear
    1981
  • fDate
    8/1/1981 12:00:00 AM
  • Firstpage
    196
  • Lastpage
    197
  • Abstract
    This letter reports some interesting results on the two-dimensional effects of the capacitances of LSI metallic interconnect wires, based on a numerical analysis of the Laplace´s equation. Our findings show that there exists an optimum condition for the relation between line-and-space and coupling capacitances.
  • Keywords
    Conductors; Delay effects; Insulation; Laplace equations; Large scale integration; MOSFETs; Numerical analysis; Parasitic capacitance; Problem-solving; Wires;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1981.25399
  • Filename
    1481883
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1077683