• DocumentCode
    107803
  • Title

    Settling Time and Noise Optimization of a Three-Stage Operational Transconductance Amplifier

  • Author

    Seth, Sachin ; Murmann, Boris

  • Author_Institution
    Department of Electrical Engineering, Stanford University, Stanford, CA, USA
  • Volume
    60
  • Issue
    5
  • fYear
    2013
  • fDate
    May-13
  • Firstpage
    1168
  • Lastpage
    1174
  • Abstract
    This paper presents the design and optimization of a nested-Miller compensated, three-stage operational transconductance amplifier (OTA) for use in switched-capacitor (SC) circuits. Existing design methods for three-stage OTAs often lead to sub-optimal solutions because they decouple inter-related metrics like noise and settling performance. In our approach, the problem of finding an optimal design with the best total integrated noise and settling time has been cohesively solved by formulating a nonlinear constrained optimization program. Equality, inequality, and semi-infinite constraints are formed using closed form symbolic expressions obtained by a closed loop analysis of the SC gain stage and the optimization program is solved by using the interior-point algorithm. For the optimization routine, there is no need to interface with a circuit simulator because all significant device parasitics are included in the model. The optimization and modeling steps are general in nature and can be applied to any amplifier or filter topology. Simulation results show that a 90-nm prototype amplifier achieves a \\pm 0.1{\\hbox {%}} dynamic error settling time of 2.5 ns with a total integrated noise of 240 \\mu {\\rm V}_{\\rm \\rms} , while consuming 5.2 mW from a 1-V power supply.
  • Keywords
    Circuit optimization; Integrated circuit noise; Power demand; Switched capacitor circuits; Thermal noise; Circuit optimization; integrated circuit noise; nested Miller compensation; switched-capacitor circuits; thermal noise; three-stage amplifier;
  • fLanguage
    English
  • Journal_Title
    Circuits and Systems I: Regular Papers, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1549-8328
  • Type

    jour

  • DOI
    10.1109/TCSI.2013.2244325
  • Filename
    6487421