Title :
Hybrid integration of waveguide photodiode and preamplifier IC using Au stud bump
Author :
Hatta, Tatsuo ; Miyahara, Toshiharu ; Okada, Norio ; Ishizaki, Mitsunori ; Nakaji, Masaharu ; Ishimura, Eitaro ; Motoshima, Kuniaki
Author_Institution :
Inf. Technol. R&D Center, Mitsubishi Electr. Corp., Hyogo
Abstract :
The authors developed an InP photodiode (PD) module integrated with an InP HBT preamplifier IC by using an Au stud bump. Theoretical analysis shows that the deviation of the group delay linearly increases in the inductance between the PD and IC. The flip-chip bonding based on the Au stud bump effectively reduces the inductance without sacrificing the individual device performance and reliability. Experimental results show that this technique is suitable for the receiver modules designed for applications with a bandwidth greater than 40 Gb/s
Keywords :
carbon fibre reinforced composites; electromagnetic shielding; electronics packaging; error statistics; modules; optical receivers; optical transmitters; transceivers; 1.0 mm; 10 Gbit/s; bit-error-rate; carbon-fiber epoxy composite; electromagnetic immunity; electromagnetic susceptibility; jitter; optical transceiver module; plastic composite package; shielding effectiveness; Delay effects; Delay lines; Gold; Heterojunction bipolar transistors; Hybrid integrated circuits; Indium phosphide; Inductance; Performance analysis; Photodiodes; Preamplifiers; Digital modulation; flip-chip devices; inductance; photodiodes (PDs);
Journal_Title :
Lightwave Technology, Journal of
DOI :
10.1109/JLT.2006.878044
