DocumentCode
1078304
Title
Fabrication of catheter-tip and sidewall miniature pressure sensors
Author
Esashi, Masayoshi ; Komatsu, Hiroshi ; Matsuo, Tadayuki ; Takahashi, Masafumi ; Takishima, Tamotsu ; Imabayashi, Kenichi ; Ozawa, Hideo
Author_Institution
Tohoku University, Sendai, Japan
Volume
29
Issue
1
fYear
1982
fDate
1/1/1982 12:00:00 AM
Firstpage
57
Lastpage
63
Abstract
Silicon-diaphragm miniature pressure sensors, which use the piezoresistive effect, were developed for biomedical applications. We fabricated two types of sensors; that is, a catheter-tip (1.2-mm outside diameter, 0.17 mm thick) and a sidewall (1.4 × 3.45 × 0.22 mm) sensor, both having a thin circular diaphragm. Their diaphragms, 10 µm in thickness and 0.55 mm in diameter, were formed by an electrochemical etching method. Since the stability of pressure sensors is the most important requirement for precise pressure measurements, attractive approaches have been investigated to improve stability. The major instabilities of the present miniature pressure sensors are electrical drifts caused by leakage currents and thermal disturbances related to packaging stress. A shield and a guard plate can prevent the device from leakage currents. A thick supporting rim structure of the sensor and mounting on a stainless steel support with elastic material contribute to eliminate the packaging stress. For the purpose of easy lead attachment to the catheter-tip sensor, we use a unique structure having deep contact holes in deposited thick polysilicon layer (0.05 mm thick). Experimental results are as follows: Initial drift after power up was improved to about one tenth. Thermal disturbances, as temperature zero shift, thermal transient response, and temperature cycle hysteresis were greatly reduced. Low-temperature zero shift of 0.2 mmHg/°C was obtained using a simple temperature compensation method. Long-term drift was 0.6 mmHg/day. The catheter of 1.8-mm outer diameter having two sidewall sensors has been satisfactorily used for the study of urodynamics.
Keywords
Biosensors; Etching; Fabrication; Leakage current; Packaging; Piezoresistance; Pressure measurement; Stability; Temperature sensors; Thermal stresses;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.20658
Filename
1482155
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