DocumentCode :
1078529
Title :
Vertically laminated magnetic cores by electroplating Ni-Fe into micromachined Si
Author :
Arnold, David P. ; Zana, Iulica ; Cros, Florent ; Allen, Mark G.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume :
40
Issue :
4
fYear :
2004
fDate :
7/1/2004 12:00:00 AM
Firstpage :
3060
Lastpage :
3062
Abstract :
The fabrication and characterization of vertically laminated, electrodeposited Ni-Fe magnetic cores in micromachined silicon for the low megahertz frequency range is presented. Laminated cores were fabricated by etching vertical trenches (60-180 μm wide and 525 μm deep) through silicon wafers and directly plating Ni-Fe onto the etched sidewalls. The Ni-Fe was plated over a range of thicknesses (3-53 μm) in order to study the influence of eddy currents. The measured impedances in the range 10 kHz-40 MHz confirm the reduction of eddy current losses. This work demonstrates a simple fabrication method for achieving high-aspect-ratio, vertically laminated magnetic cores where the geometry of the structures can be easily tailored for various applications.
Keywords :
Permalloy; eddy current losses; electroplating; etching; laminations; magnetic cores; micromachining; micromechanical devices; nickel alloys; 0.01 to 40 MHz; 3 to 53 micron; 525 micron; 60 to 180 micron; MEMS; Ni-Fe magnetic cores; NiFe; Si; eddy current influence; eddy current loss reduction; electrodeposition; electroplating; high-aspect-ratio; laminated core fabrication; low megahertz frequency range; magnetic core fabrication; micromachined Si; micromachined silicon; nickel alloys; permalloy; silicon wafers; structure geometry; vertical lamination; vertical trench etching; vertically laminated magnetic cores; Current measurement; Eddy currents; Etching; Fabrication; Frequency; Geometry; Impedance measurement; Loss measurement; Magnetic cores; Silicon; Eddy currents; MEMS; magnetic cores; micromachining; nickel alloys; permalloy;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2004.829013
Filename :
1325732
Link To Document :
بازگشت