Title :
Fabrication of Multilevel Silicon Diffractive Lens at Terahertz Frequency
Author :
Saha, S.C. ; Li, Cong ; Ma, Yanru ; Grant, J.P. ; Cumming, D.
Author_Institution :
Electron. & Nanoscale Eng. Dept., Univ. of Glasgow, Glasgow, UK
Abstract :
In this paper, we fabricated an anisotropically etched multilevel silicon diffractive lens. The operating frequency and focal length of the lens are 2.52 THz and 15 mm, respectively. Both 4- and 16-level lenses have been realized. The total etch depth and size of the lenses are 49 μm and 45 mm × 45 mm. Positive tone thick resist AZ 4562 was used as a mask material for dry etching the high resistivity silicon substrate. We have characterized the lens using a high power continuous wave far infrared laser operating at 2.52 THz. The measured results show good agreement with the designed specifications.
Keywords :
etching; infrared spectra; lenses; masks; micro-optics; optical fabrication; photoresists; silicon; submillimetre wave lasers; anisotropically etching; depth 49 mum; dry etching; focal length; frequency 2.52 THz; high power continuous wave far infrared laser; mask material; multilevel silicon diffractive lens; positive tone thick resist AZ 4562; size 45 mm; total etch depth; Beam steering; lenses; microoptics; optical device fabrication; silicon devices; submillimeter-wave devices;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2013.2251929