DocumentCode
1078959
Title
Two-and three-dimensional analytical solutions for post-anneal implant profiles through arbitrary mask edges
Author
Krusius, J. Peter ; Nulman, Jaime ; Faricelli, John V. ; Frey, Jeffrey
Author_Institution
Cornell University, Ithaca, NY
Volume
29
Issue
3
fYear
1982
fDate
3/1/1982 12:00:00 AM
Firstpage
435
Lastpage
444
Abstract
To fill the need for the description of ion-implanted doping profiles for realistic mask edges after annealing or diffusion steps, an analytical solution to the post-anneal implant profile in two and three dimensions for an arbitrary mask edge profile is given here. The technique is applied first to large-area boron implant in Si. The second example is an implant through an ideal 2-µm step window with vertical walls, and the third an implant through a realistic representation of an ion-milled window in SiO2 . Experimental data for the latter case, derived from SEM analysis of cleaved and selectively etched structures, are also presented. Examples given show that the analytical solution is easily applied to any given implant/anneal conditions in two and three dimensions, and may thus be used as a simple tool for studying the effect of implant, mask, and annealing conditions on the doping profiles of submicrometer structures.
Keywords
Annealing; Boron; Circuit simulation; Doping profiles; Etching; Helium; Implants; Lithography; Process design; Very high speed integrated circuits;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.20720
Filename
1482217
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