• DocumentCode
    1078959
  • Title

    Two-and three-dimensional analytical solutions for post-anneal implant profiles through arbitrary mask edges

  • Author

    Krusius, J. Peter ; Nulman, Jaime ; Faricelli, John V. ; Frey, Jeffrey

  • Author_Institution
    Cornell University, Ithaca, NY
  • Volume
    29
  • Issue
    3
  • fYear
    1982
  • fDate
    3/1/1982 12:00:00 AM
  • Firstpage
    435
  • Lastpage
    444
  • Abstract
    To fill the need for the description of ion-implanted doping profiles for realistic mask edges after annealing or diffusion steps, an analytical solution to the post-anneal implant profile in two and three dimensions for an arbitrary mask edge profile is given here. The technique is applied first to large-area boron implant in Si. The second example is an implant through an ideal 2-µm step window with vertical walls, and the third an implant through a realistic representation of an ion-milled window in SiO2. Experimental data for the latter case, derived from SEM analysis of cleaved and selectively etched structures, are also presented. Examples given show that the analytical solution is easily applied to any given implant/anneal conditions in two and three dimensions, and may thus be used as a simple tool for studying the effect of implant, mask, and annealing conditions on the doping profiles of submicrometer structures.
  • Keywords
    Annealing; Boron; Circuit simulation; Doping profiles; Etching; Helium; Implants; Lithography; Process design; Very high speed integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1982.20720
  • Filename
    1482217