DocumentCode
1079121
Title
Poly (phenyl methacrylate-co-methacrylic acid) as a dry-etching durable positive electron resist
Author
Harada, Katsuhiro ; Kogure, Osamu ; Murase, Kei
Author_Institution
Nippon Telegraph and Telephone Public Corporation, Tokai, Ibaraki, Japan
Volume
29
Issue
4
fYear
1982
fDate
4/1/1982 12:00:00 AM
Firstpage
518
Lastpage
524
Abstract
Copolymers of phenyl methacrylate and methacrylic acid (φ-MAC) have been investigated as dry-etching durable positive electron resists. φ-MAC´s are preheated above 170°C to crosslink the polymers by intermolecular acid anhydride bonds. The crosslinked φ-MAC´s become insoluble and do not swell even in development with strong solvents. They also have excellent thermal stability. These properties contribute to their high sensitivity of 5 µC/cm2, γ(contrast) = 2.0, and resolution finer than 0.2-µm line patterns (65 µC/cm2). φ-MAC´s have excellent dry-etching durabilities (e.g., 2 times stronger than PMMA in reactive sputter etching) and good adhesion to the substrate due to the protective effect of benzene rings and the adherent effect of carboxylic acid groups, respectively. The good properties of φ-MAC´s make them prospective in the submicrometer electron lithography.
Keywords
Adhesives; Dry etching; Electrons; Lithography; Polymers; Resists; Sputter etching; Thermal stability; Vents; Wet etching;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1982.20736
Filename
1482233
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