• DocumentCode
    1079121
  • Title

    Poly (phenyl methacrylate-co-methacrylic acid) as a dry-etching durable positive electron resist

  • Author

    Harada, Katsuhiro ; Kogure, Osamu ; Murase, Kei

  • Author_Institution
    Nippon Telegraph and Telephone Public Corporation, Tokai, Ibaraki, Japan
  • Volume
    29
  • Issue
    4
  • fYear
    1982
  • fDate
    4/1/1982 12:00:00 AM
  • Firstpage
    518
  • Lastpage
    524
  • Abstract
    Copolymers of phenyl methacrylate and methacrylic acid (φ-MAC) have been investigated as dry-etching durable positive electron resists. φ-MAC´s are preheated above 170°C to crosslink the polymers by intermolecular acid anhydride bonds. The crosslinked φ-MAC´s become insoluble and do not swell even in development with strong solvents. They also have excellent thermal stability. These properties contribute to their high sensitivity of 5 µC/cm2, γ(contrast) = 2.0, and resolution finer than 0.2-µm line patterns (65 µC/cm2). φ-MAC´s have excellent dry-etching durabilities (e.g., 2 times stronger than PMMA in reactive sputter etching) and good adhesion to the substrate due to the protective effect of benzene rings and the adherent effect of carboxylic acid groups, respectively. The good properties of φ-MAC´s make them prospective in the submicrometer electron lithography.
  • Keywords
    Adhesives; Dry etching; Electrons; Lithography; Polymers; Resists; Sputter etching; Thermal stability; Vents; Wet etching;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1982.20736
  • Filename
    1482233