DocumentCode :
1079121
Title :
Poly (phenyl methacrylate-co-methacrylic acid) as a dry-etching durable positive electron resist
Author :
Harada, Katsuhiro ; Kogure, Osamu ; Murase, Kei
Author_Institution :
Nippon Telegraph and Telephone Public Corporation, Tokai, Ibaraki, Japan
Volume :
29
Issue :
4
fYear :
1982
fDate :
4/1/1982 12:00:00 AM
Firstpage :
518
Lastpage :
524
Abstract :
Copolymers of phenyl methacrylate and methacrylic acid (φ-MAC) have been investigated as dry-etching durable positive electron resists. φ-MAC´s are preheated above 170°C to crosslink the polymers by intermolecular acid anhydride bonds. The crosslinked φ-MAC´s become insoluble and do not swell even in development with strong solvents. They also have excellent thermal stability. These properties contribute to their high sensitivity of 5 µC/cm2, γ(contrast) = 2.0, and resolution finer than 0.2-µm line patterns (65 µC/cm2). φ-MAC´s have excellent dry-etching durabilities (e.g., 2 times stronger than PMMA in reactive sputter etching) and good adhesion to the substrate due to the protective effect of benzene rings and the adherent effect of carboxylic acid groups, respectively. The good properties of φ-MAC´s make them prospective in the submicrometer electron lithography.
Keywords :
Adhesives; Dry etching; Electrons; Lithography; Polymers; Resists; Sputter etching; Thermal stability; Vents; Wet etching;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1982.20736
Filename :
1482233
Link To Document :
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