DocumentCode :
1079195
Title :
MOS Device and technology constraints in VLSI
Author :
El-Mansy, Youssef
Author_Institution :
Intel Corporation, Aloha, OR
Volume :
29
Issue :
4
fYear :
1982
fDate :
4/1/1982 12:00:00 AM
Firstpage :
567
Lastpage :
573
Abstract :
As devices and technology are scaled to achieve performance and density improvements, a number of constraints come into play. These constraints apply to both the parasitics as well as the intrinsic device and reduce the benefits that would have otherwise been available from scaling. In this paper, a number of performance limiters are pointed out. Specifically, velocity saturation, parasitic source-drain series resistance, finite channel thickness, and hot-carrier effects are analyzed and their effects on performance are evaluated. Future trends as impacted by these limiters are explored for both p- and n-channel devices.
Keywords :
Design methodology; Doping; Helium; High speed integrated circuits; Hot carrier effects; MOS devices; Performance analysis; Process design; Very large scale integration; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1982.20744
Filename :
1482241
Link To Document :
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