New mullite ceramic packages and substrates

Author

Horiuchi, Michio ; Mizushima, Kihou ; Takeuchi, Yukiharu ; Wakabayashi, Shin-ichi

Author_Institution

Shinko Electr. Ind. Co. Ltd., Nagano, Japan

Volume

11

Issue

4

fYear

1988

Firstpage

439

Lastpage

446

Abstract

The authors describe the fabrication technologies and properties of new mullites for advanced VLSI packaging technology, as well as applications utilizing their characteristics. These new mullite ceramic substrates have the following characteristics: (1) low dielectric constants (5.4-7.5), which facilitate the realization of a device manifesting a high speed of signal transmission; (2) low thermal expansion coefficients (3.0-4.05*10/sup -6// degrees C), which permit the direct attachment of a large silicon chip; and (3) sufficiently high flexural strength (20-31 kg/mm/sup 2/), providing high mechanical reliability for practical use. It is concluded that, as a result of these characteristics, the new mullite packages and substrates could guarantee a highly reliable attachment for a large silicon chip and high signal transmission speed.<>

Keywords

VLSI; ceramics; circuit reliability; packaging; permittivity; VLSI packaging; dielectric constants; flexural strength; mechanical reliability; mullite ceramic packages; mullite ceramic substrates; signal transmission; thermal expansion coefficients; Ceramics; Conducting materials; Costs; Dielectric constant; Dielectric materials; Electronics packaging; Integrated circuit technology; Silicon; Thermal conductivity; Thermal expansion;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.16680

Filename

16680