Title :
Platinum silicide fusion bonding
Author :
Ismail, Mohamad Safari ; Bower, R.W.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Davis, CA, USA
fDate :
6/20/1991 12:00:00 AM
Abstract :
Silicide direct bonding has been accomplished between silicon PtSi coated wafers and both PtSi coated and uncoated silicon wafers. Successful bonding occurred when the PtSi surface was rendered hydrophilic by a hot aqua regia selective etching and cleaning process. The PtSi provides bondable, relatively low resistance paths which provide electrical interconnections between circuit elements on the bonded pair of wafers.
Keywords :
integrated circuit technology; lead bonding; platinum compounds; semiconductor technology; surface treatment; 3D ICs; Si wafers; Si-PtSi; aligned wafer bonding; cleaning process; electrical interconnections; fusion bonding; hot aqua regia selective etching; hydrophilic surface;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19910719
