• DocumentCode
    1081409
  • Title

    Electrolytic models for metallic electromigration failure mechanisms

  • Author

    Krumbein, Simeon J.

  • Author_Institution
    AMP Inc., Harrisburg, PA, USA
  • Volume
    44
  • Issue
    4
  • fYear
    1995
  • fDate
    12/1/1995 12:00:00 AM
  • Firstpage
    539
  • Lastpage
    549
  • Abstract
    Metallic electromigration is the movement of metallic material across a nonmetallic medium, under the influence of an electric field. It is increasingly important in the performance and reliability of electronic systems as an underling cause of functional failures in electrical and electronic components. This tutorial discusses the characteristics of the various electromigration mechanisms, with primary emphasis on electrolytically-controlled processes that occur under low power and relatively ambient conditions
  • Keywords
    circuit reliability; electric fields; electrolysis; electromigration; failure analysis; reliability theory; characteristics; electric field; electrical components; electrolytic models; electronic components; electronic systems; failure mechanisms; metallic electromigration; performance; reliability; tutorial; Conducting materials; Conductors; Copper; Electromigration; Electronic components; Failure analysis; Inorganic materials; Scanning electron microscopy; Silver; Tutorial;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.475971
  • Filename
    475971