DocumentCode
1081409
Title
Electrolytic models for metallic electromigration failure mechanisms
Author
Krumbein, Simeon J.
Author_Institution
AMP Inc., Harrisburg, PA, USA
Volume
44
Issue
4
fYear
1995
fDate
12/1/1995 12:00:00 AM
Firstpage
539
Lastpage
549
Abstract
Metallic electromigration is the movement of metallic material across a nonmetallic medium, under the influence of an electric field. It is increasingly important in the performance and reliability of electronic systems as an underling cause of functional failures in electrical and electronic components. This tutorial discusses the characteristics of the various electromigration mechanisms, with primary emphasis on electrolytically-controlled processes that occur under low power and relatively ambient conditions
Keywords
circuit reliability; electric fields; electrolysis; electromigration; failure analysis; reliability theory; characteristics; electric field; electrical components; electrolytic models; electronic components; electronic systems; failure mechanisms; metallic electromigration; performance; reliability; tutorial; Conducting materials; Conductors; Copper; Electromigration; Electronic components; Failure analysis; Inorganic materials; Scanning electron microscopy; Silver; Tutorial;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/24.475971
Filename
475971
Link To Document