Design and fabrication of a transmitter optical subassembly (TOSA) in 10-gb/s small-form-factor pluggable (XFP) transceiver

Author

Kim, Dongchurl ; Shim, Jongin ; Keh, Yong-Chan ; Park, Munkyu

Author_Institution

Dept. of Electr. & Comput. Eng., Hanyang Univ., Ansan

Volume

12

Issue

4

fYear

2006

Firstpage

776

Lastpage

782

Abstract

A smart and compact packaging transmitter optical subassembly (TOSA) in a 10-Gb/s small-form-factor pluggable (XFP) transceiver module has been developed with an eye towards electrical and thermal performances. In the TOSA, a bias-tee circuit and a matching resistor are monolithically integrated on an AlN submount with high thermal conductivity, and a newly proposed coplanar waveguide is drawn in a transistor outline (TO)-stem. In order to improve the electrical performance of the TOSA, the equivalent circuit model of all optoelectronic components in the TOSA is introduced and utilized. The fabricated TOSA shows the -3-dB bandwidth as high as 11 GHz and 0.36-dB penalty after a 75-km transmission at an elevated temperature of 85degC

Keywords

optical design techniques; optical fabrication; optical transmitters; semiconductor device packaging; thermal conductivity; transceivers; 10 Gbit/s; 75 km; 85 degC; TOSA; XFP; coplanar waveguide; small-form-factor pluggable transceiver; thermal conductivity; transmitter optical subassembly; Circuits; Optical design; Optical device fabrication; Optical transmitters; Optical waveguides; Packaging; Resistors; Thermal conductivity; Thermal resistance; Transceivers; 10-Gb/s-small-form-factor pluggable (XFP); Distributed feedback laser diode (DFB-LD); semiconductor device packaging; transmitter optical subassembly (TOSA);

fLanguage

English

Journal_Title

Selected Topics in Quantum Electronics, IEEE Journal of

Publisher

ieee

ISSN

1077-260X

Type

jour

DOI

10.1109/JSTQE.2006.876184

Filename

1668122