• DocumentCode
    1082593
  • Title

    The effects of laminations on steep fronted surge propagation in large AC motor coils

  • Author

    Keerthipala, W.W.L. ; McLaren, P.G.

  • Author_Institution
    Dept. of Electr. Eng., Manitoba Univ., Man., Canada
  • Volume
    5
  • Issue
    1
  • fYear
    1990
  • fDate
    3/1/1990 12:00:00 AM
  • Firstpage
    84
  • Lastpage
    90
  • Abstract
    To date, the modeling of machine windings for steep fronted surge propagation has been based on an assumption that the slot walls act as flux barriers at the frequencies of interest (1 to 10 MHz). This assumption led to the use of a line end coil structure embedded in a solid slot core for experiments, and excellent agreement between measured and computed waveforms has been reported by P.G. McLaren et al. (1988). The assumption is valid for a solid slot environment as the magnetic flux cannot penetrate beyond the skin depth, δ, which is on the order of 10-6 m for the frequencies concerned. However, this is not the case for a laminated slot environment as it can allow magnetic flux penetration deeper into the core that the skin depth, δ. In the present study, the effects of such a flux penetration on steep fronted surge propagation in large AC motor coils are studied. The results obtained demonstrate that the solid slot models cannot accurately replace the actual laminated environments in the study of steep fronted surge propagation in machine windings. Maximum interturn voltages observed for the solid slot model are smaller (by a factor of about 2/3) than those for the laminated slot environment
  • Keywords
    AC motors; coils; laminations; 1 to 10 MHz; flux penetration; laminations; large AC motor coils; line end coil structure; magnetic flux; maximum interturn voltages; solid slot core; steep fronted surge propagation; Coils; Embedded computing; Frequency; Lamination; Machine windings; Magnetic cores; Magnetic flux; Skin; Solid modeling; Surges;
  • fLanguage
    English
  • Journal_Title
    Energy Conversion, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-8969
  • Type

    jour

  • DOI
    10.1109/60.50817
  • Filename
    50817