DocumentCode :
1082703
Title :
Wafer-Level Process for Single-Use Buckling-Film Microliter-Range Pumps
Author :
Samel, Björn ; Chretien, Julien ; Yue, Ruifeng ; Griss, Patrick ; Stemme, Göran
Author_Institution :
Royal Inst. of Technol.-KTH, Stockholm
Volume :
16
Issue :
4
fYear :
2007
Firstpage :
795
Lastpage :
801
Abstract :
In this paper, we present the development of disposable single-use microfluidic pumps entirely based on a straightforward wafer-level fabrication scheme, which allows for precise integrated active dosing in the microliter range. To accomplish stroke-lengths needed for microliter-range applications, we utilize a new method of bending of a unimorph-composite-actuator film. The unimorph composite actuator consists of a temperature-sensitive silicone elastomer composite, i.e., polydimethylsiloxane, with incorporated expandable microspheres. The fabricated micropumps successfully demonstrated precise liquid-volume control, both at low and high flow rates, and show a standard deviation of 6.7% for consecutive pump experiments. Moreover, the method of fluorescent thermometry was used to measure the thermal load on liquid volumes dispensed with the micropumps. The liquid temperature reaches a maximum of 50degC during the operation. The presented fully integrated single-use micropumps are electrically controllable, do not require external means for liquid actuation, are made of low-cost materials only, and might potentially be used in drug-delivery applications.
Keywords :
buckling; elastomers; microfluidics; micropumps; wafer level packaging; buckling-film microliter-range pumps; fluorescent thermometry; polydimethylsiloxane; single-use microfluidic pumps; temperature-sensitive silicone elastomer composite; thermal load measurement; unimorph-composite-actuator film; wafer-level fabrication; Actuators; Costs; Fabrication; Fluorescence; Laboratories; Microfluidics; Micromechanical devices; Micropumps; Production; Volume measurement; Fabrication; fluidics; micropumps; wafer-scale integration;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2007.901642
Filename :
4285649
Link To Document :
بازگشت