DocumentCode
108303
Title
Applicability of Reel-to-Reel RHQ Treatments to
Precursors With a Ta/Cu/Ta Three-Layer Filament-Barrier Structure
Author
Takeuchi, T. ; Nakagawa, Koichi ; Tsuchiya, K. ; Banno, N. ; Matsumoto, Akiyoshi ; Iijima, Y. ; Kikuchi, A. ; Nakamoto, Takamichi
Author_Institution
Nat. Inst. for Mater. Sci. (NIMS), Tsukuba, Japan
Volume
23
Issue
3
fYear
2013
fDate
Jun-13
Firstpage
6000805
Lastpage
6000805
Abstract
A tension-free rapid heating and quenching (RHQ) simulator was previously employed to demonstrate that a ductile and normal-conducting Cu layer can suppress a magnetic field instability and improve bending strain tolerance. However, a molten Cu barrier caused the filament to be shifted from the original location, and excess heating caused the Cu to locally corrode a Ta layer, through which it diffused into the filament, thereby embrittling the resulting wire. In some cases, the swelling molten-Cu tore the Ta skin. Fabrication of a long piece of Ta/Cu/Ta barrier Nb3Al wire is attempted using reel-to-reel RHQ treatment of a modified precursor with a thicker Ta skin that would tolerate both tension forces in a section of the wire between electrodes and pressure from the swelling of molten-Cu. In the optimum RHQ condition (VRHQ: 9.5 V), a 50-m piece of Ta/Cu/Ta barrier precursor was successfully reel-to-reel RHQ treated to form a bcc supersaturated-solid solution (Nb(Al)ss) without bursting of the Ta skin. Microstructural analysis revealed that the molten Cu, into which Ta dissolved, diffused into the jelly-roll filament, mainly through a region of partially melted Al-rich Nb( Al)ss. The critical current density of the filament Jc (18 T, 4.2 K) was optimized by the deformation of Nb(Al)ss and compared favorably with the conventional precursor.
Keywords
aluminium alloys; bending; copper; critical current density (superconductivity); crystal microstructure; electrodes; niobium alloys; quenching (thermal); solid solutions; swelling; tantalum; Nb deformation; Nb3Al; RHQ simulator; Ta layer; Ta skin; Ta-Cu-Ta; Ta-Cu-Ta barrier precursor; Ta-Cu-Ta barrier wire; Ta-Cu-Ta three-layer filament-barrier structure; bcc supersaturated-solid solution; bending strain tolerance; ductile Cu layer; electrodes; excess heating; filament critical current density; jelly-roll filament; magnetic field instability; microstructural analysis; modified precursor; molten Cu barrier; normal-conducting Cu layer; optimum RHQ condition; partially melted Al-rich Nb region; quenching; reel-to-reel RHQ treatments; size 50 m; swelling molten-Cu; tension forces; tension-free rapid heating; voltage 9.5 V; Electrodes; Heat treatment; Heating; Integrated circuits; Magnetic fields; Skin; Wires; Deformed-and-transformed; drawability; partial melting; reaction of Cu with Ta;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/TASC.2012.2236876
Filename
6397583
Link To Document