• DocumentCode
    1083365
  • Title

    Breakdown stability of gold, aluminum, and tungsten Schottky barriers on gallium arsenide

  • Author

    Baliga, B.J. ; Ehle, R. ; Sears, A. ; Campbell, P. ; Garwacki, W. ; Katz, W.

  • Author_Institution
    General Electric Company, Schenectady, NY
  • Volume
    3
  • Issue
    7
  • fYear
    1982
  • fDate
    7/1/1982 12:00:00 AM
  • Firstpage
    177
  • Lastpage
    179
  • Abstract
    The stability of the breakdown voltage of Au, Al, and W Schottky barrier diodes fabricated on n-type GaAs has been evaluated. The nearly ideal breakdown voltage of Au diodes was found to degrade upon annealing, even at below 150°C. The breakdown voltage of the as-deposited Al diodes was half that of the Au diodes, and degraded upon annealing at above 450°C. Secondary ion mass spectroscopy (SIMS) measurements revealed penetration of Al into the GaAs. The breakdown voltage of W diodes increased to equal that of the Au diodes upon annealing above 400°C and remained stable at up to 550°C. No interdiffusion at the W/GaAs interface was observed.
  • Keywords
    Aluminum; Annealing; Degradation; Electric breakdown; Gallium arsenide; Gold; Schottky barriers; Schottky diodes; Stability; Tungsten;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/EDL.1982.25528
  • Filename
    1482633