DocumentCode :
1083622
Title :
Critical evaluation of SOI design guidelines
Author :
Kanj, Rouwaida ; Rosenbaum, Elyse
Author_Institution :
Electr. & Comput. Eng. Dept., Univ. of Illinois, Urbana, IL, USA
Volume :
12
Issue :
9
fYear :
2004
Firstpage :
885
Lastpage :
894
Abstract :
Design guidelines for static and domino silicon-on-insulator (SOI) CMOS circuits are evaluated. Restructuring the logic to eliminate gates with large fan-ins is almost as beneficial for SOI as for bulk-silicon. Most published design fixes for eliminating parasitic bipolar induced upset are shown to aggravate the charge sharing problem. A new and improved predischarge method for enhancing the noise tolerance of SOI domino circuits is thus proposed . The topic of multiple output domino logic in SOI technology is addressed for the first time. Multiple output domino logic is shown to be more prone to bipolar leakage induced upset than regular domino. Many of the design practices used to alleviate bipolar leakage in regular domino are no longer valid due to the multiple output domino logic´s inherent design requirements. A novel SOI-specific multiple output domino logic, particularly suitable for adder designs, is introduced to minimize the bipolar leakage risk.
Keywords :
BiCMOS logic circuits; adders; elemental semiconductors; integrated circuit design; integrated circuit noise; leakage currents; logic design; logic gates; silicon; silicon-on-insulator; SOI design guidelines; SOI domino circuits; SOI technology; Si; adder designs; bipolar leakage induced upset; bulk-silicon; charge sharing problem; domino logic; domino silicon-on-insulator CMOS circuits; logic gates; noise tolerance; parasitic bipolar induced upset; static silicon-on-insulator CMOS circuits; CMOS logic circuits; CMOS technology; Circuit simulation; Delay; Guidelines; Integrated circuit technology; Logic design; Logic devices; Logic gates; Silicon on insulator technology;
fLanguage :
English
Journal_Title :
Very Large Scale Integration (VLSI) Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
1063-8210
Type :
jour
DOI :
10.1109/TVLSI.2004.833665
Filename :
1327625
Link To Document :
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