• DocumentCode
    1083694
  • Title

    Run-by-Run Process Control of Metal Sputter Deposition: Combining Time Series and Extended Kalman Filter

  • Author

    Chen, Juhn-Horng ; Kuo, Tzu-Wei ; Lee, An-Chen

  • Author_Institution
    Chung Hua Univ., Hsinchu
  • Volume
    20
  • Issue
    3
  • fYear
    2007
  • Firstpage
    278
  • Lastpage
    285
  • Abstract
    By the time series model, this paper constructed the disturbance model for the aluminum sputter deposition process and derived the extending Kalman filter (EKF) controller based on this new disturbance model. Experimental results reveal that ARI(3,1) model appropriately characterizes the dynamic behavior of the disturbance for the processes. The EKF controller which includes information of process noise and measurement noise is able to regulate the model coefficients automatically as the target is replaced or degrades. In this paper, the d-EWMA controller, time-varying d-EWMA controller, age-based d-EWMA controller, and EKF controller have been applied to aluminum sputter deposition processes for predicting deposition rates and comparing their performances. The application of the EKF controller here is proven to improve the estimating accuracy of the aluminum sputter deposition process significantly, regardless of whether the deposition rates are measured at each run or not.
  • Keywords
    Kalman filters; moving average processes; process control; sputter deposition; time series; aluminum sputter deposition process; extended Kalman filter; metal sputter deposition; run-by-run process control; time series; Aluminum; Automatic control; Manufacturing processes; Mechanical engineering; Noise measurement; Process control; Production facilities; Semiconductor device manufacture; Semiconductor device noise; Sputtering; d-EWMA controller; deposition rate; extended Kalman filter; time series model; time-varying d-EWMA controller;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/TSM.2007.901392
  • Filename
    4285817