DocumentCode
108398
Title
Substrate-Integrated Waveguide Bandpass Filters With Planar Resonators for System-on-Package
Author
Wei Shen ; Wen-Yan Yin ; Xiao-Wei Sun ; Lin-Sheng Wu
Author_Institution
Center for Microwave & RF Technol., Shanghai Jiao Tong Univ., Shanghai, China
Volume
3
Issue
2
fYear
2013
fDate
Feb. 2013
Firstpage
253
Lastpage
261
Abstract
This paper proposes some novel substrate-integrated waveguide (SIW) bandpass filters combined with planar resonators. According to specific topologies, microstrip lines with different electrical lengths are introduced into their designs. Their corresponding phase-shift characteristics are used to obtain the desired couplings between SIW cavities and the microstrip resonator. Two third-order filter samples are realized. One has a single transmission zero below the passband and the other possesses a quasi-elliptic response. Further, a fourth-order filter is developed by effectively superpositing two individual third-order topologies. It shows better frequency selectivity and flat in-band group delay, with good agreement between the measured and the simulated S-parameters. Their compactness and high rejection in the stopbands make them very suitable for system-on-package.
Keywords
S-parameters; band-pass filters; microstrip lines; microstrip resonators; substrate integrated waveguides; system-on-package; S-parameters; SIW bandpass filters; SIW cavities; electrical lengths; flat in-band group delay; fourth-order filter; frequency selectivity; microstrip lines; microstrip resonator; phase-shift characteristics; planar resonators; quasielliptic response; substrate-integrated waveguide bandpass filters; system-on-package; third-order filter samples; third-order topologies; transmission zero; Cavity resonators; Couplings; Filtering theory; Microstrip resonators; Q factor; Resonant frequency; $S$ -parameters; bandpass filter; dual-mode resonator; quasi-elliptic function; substrate-integrated waveguide; system on package; transmission zeros;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2012.2224348
Filename
6397590
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