DocumentCode
1084272
Title
Monte Carlo Stress Engineering of Scaled (110) and (100) Bulk pMOSFETs
Author
Bufler, F.M. ; Gautschi, R. ; Erlebach, A.
Author_Institution
ETH Zurich, Zurich
Volume
29
Issue
4
fYear
2008
fDate
4/1/2008 12:00:00 AM
Firstpage
369
Lastpage
371
Abstract
Bulk pMOSFET performance enhancement by combinations of SiGe pockets, compressively stressed cap liner and (110) surface orientation is investigated by mechanical stress and Monte Carlo device simulation. In agreement with recent measurements, the on-current gain by a (110) surface orientation of the 45 nm pMOSFET with a 3 GPa compressive cap liner is 32% and 16% without and with the presence of Si0.8Ge0.2 pockets, respectively. However, the performance enhancement by a (110) surface orientation strongly decreases upon scaling and for increasing liner stress. This suggests that the enhanced mobility for (110) surface orientation may lose its advantage in the limit of further scaling and increasing stress.
Keywords
Ge-Si alloys; MOSFET; Monte Carlo methods; semiconductor device models; stress effects; (110) surface orientation; Monte Carlo device simulation; Monte Carlo stress engineering; Si0.8Ge0.2; SiGe pockets; bulk pMOSFET performance enhancement; compressive cap liner; mechanical stress; pressure 3 GPa; size 45 nm; (110)-surface; Enhanced mobility; Monte Carlo (MC) device simulation; PMOS; stress engineering;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.917633
Filename
4459061
Link To Document