DocumentCode :
1084272
Title :
Monte Carlo Stress Engineering of Scaled (110) and (100) Bulk pMOSFETs
Author :
Bufler, F.M. ; Gautschi, R. ; Erlebach, A.
Author_Institution :
ETH Zurich, Zurich
Volume :
29
Issue :
4
fYear :
2008
fDate :
4/1/2008 12:00:00 AM
Firstpage :
369
Lastpage :
371
Abstract :
Bulk pMOSFET performance enhancement by combinations of SiGe pockets, compressively stressed cap liner and (110) surface orientation is investigated by mechanical stress and Monte Carlo device simulation. In agreement with recent measurements, the on-current gain by a (110) surface orientation of the 45 nm pMOSFET with a 3 GPa compressive cap liner is 32% and 16% without and with the presence of Si0.8Ge0.2 pockets, respectively. However, the performance enhancement by a (110) surface orientation strongly decreases upon scaling and for increasing liner stress. This suggests that the enhanced mobility for (110) surface orientation may lose its advantage in the limit of further scaling and increasing stress.
Keywords :
Ge-Si alloys; MOSFET; Monte Carlo methods; semiconductor device models; stress effects; (110) surface orientation; Monte Carlo device simulation; Monte Carlo stress engineering; Si0.8Ge0.2; SiGe pockets; bulk pMOSFET performance enhancement; compressive cap liner; mechanical stress; pressure 3 GPa; size 45 nm; (110)-surface; Enhanced mobility; Monte Carlo (MC) device simulation; PMOS; stress engineering;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2008.917633
Filename :
4459061
Link To Document :
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