DocumentCode :
1085255
Title :
Vertical MOS technology with sub-0.1 μm channel lengths
Author :
Gossner, H. ; Wittmann, F. ; Eisele, I. ; Grabulla, T. ; Behammer, D.
Author_Institution :
Univ. der Bundeswehr Munchen, Neubiberg, Germany
Volume :
31
Issue :
16
fYear :
1995
fDate :
8/3/1995 12:00:00 AM
Firstpage :
1394
Lastpage :
1396
Abstract :
A vertical MOSFET with a channel length of 85 nm has been fabricated by molecular beam epitaxy. Compared to previous work, the electrical behaviour has been greatly improved, allowing the use of standard simulation tools for analysing the I-V characteristics. From experimental and theoretical results. We conclude that for vertical MOSFETs. The useful minimum channel length is not limited by the technological constraints but by the physical limits of the electrical performance. The useful minimum channel length is estimated to be ~80 nm
Keywords :
MOS integrated circuits; MOSFET; integrated circuit technology; molecular beam epitaxial growth; semiconductor growth; 80 to 85 nm; I-V characteristics; MBE; electrical behaviour; minimum channel length; molecular beam epitaxy; vertical MOS technology; vertical MOSFET;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19950890
Filename :
408349
Link To Document :
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