Title :
Mathematical model of a plated-through hole under a load induced by thermal mismatch
Author :
Mirman, Boris A.
Author_Institution :
Digital Equipment Corp., Andover, MA, USA
fDate :
12/1/1988 12:00:00 AM
Abstract :
A mathematical model simulating a plated-through hole (PTH) under a thermal load is proposed to predict PTH reliability. The PTH is treated as a system of disks joined to a barrel. Under the load, the disks bend and the barrel undergoes either tension or compression. The resulting failures are predicted by computing failure indicators. Also presented are simple formulas to estimate some of these failure indicators
Keywords :
circuit reliability; failure analysis; printed circuits; PTH reliability; failure indicators; failures; mathematical model; plated-through hole; thermal load; thermal mismatch; Failure analysis; Information analysis; Material properties; Materials testing; Mathematical model; Microstructure; Predictive models; Resins; Stress; Thermal loading;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
