Thermal characterization of plastic and ceramic surface-mount components

The thermal performance of devices packaged with the 68-, 84-, 100-, and 124-lead members of the plastic and ceramic flatpack family of surface-mounted components (PFP and CPF, respectively) is characterized. Experimental data were collected in both natural and force convection conditions for individual components surface-mounted to small sections of epoxy circuit card. Average air velocity and chip power dissipation were the primary independent test variables, ranging from 0 to 3 m/s and 0.2 to 2.0 W, respectively, for which internal and external thermal resistance data are presented. Experimental thermal resistance data exhibited the usual dependence on both Reynolds and Grashof numbers. Molding compound and leadframe materials were found by the model to have a significant effect on PFP thermal performance. Ceramic and die-attach materials were found to have significant and negligible effects, respectively, on thermal performance of the CFP package