• DocumentCode
    1086417
  • Title

    6H-SiC photoconductive switches triggered at below bandgap wavelengths

  • Author

    Sullivan, J.S. ; Stanley, J.R.

  • Author_Institution
    Univ. of California, Livermore
  • Volume
    14
  • Issue
    4
  • fYear
    2007
  • Firstpage
    980
  • Lastpage
    985
  • Abstract
    Semi-insulating silicon carbide (SiC) is an attractive material for application as high voltage, photoconductive semiconductor switches (PCSS) due to its large bandgap, high critical electric field strength, high electron saturation velocity and high thermal conductivity. The critical field strength of 300 MV/m for 6H-SiC makes it particularly attractive for compact, high voltage, fast switching applications. To realize the benefits of the high bulk electric field strength of SiC and diffuse switch current, carriers must be excited throughout the bulk of the photo switch. Photoconducting switches with opposing electrodes were fabricated on "a" plane, vanadium compensated, semi-insulating, 6H-SiC substrates. The PCSS devices were switched by optically exciting deep extrinsic levels lying within the 6H-SiC bandgap. The SiC photoswitches were tested up to a bias voltage of 11000 V with a corresponding peak current of 150 A. The 6H-SiC substrates withstood average electric fields up to 27 MV/m. Minimum PCCS dynamic resistances of 2 and 10 Ohms were obtained with 13 mJ optical pulses at 532 and 1064 nm wavelengths, respectively.
  • Keywords
    photoconducting switches; silicon compounds; substrates; thermal conductivity; wide band gap semiconductors; 6H-SiC substrates; PCSS; SiC - Binary; SiC - Interface; bandgap wavelength; high critical electric field strength; high electron saturation velocity; high thermal conductivity; photoconductive semiconductor switches; semiinsulating silicon carbide; voltage 11000 V; Conducting materials; Optical switches; Photoconducting materials; Photoconductivity; Photonic band gap; Semiconductor materials; Silicon carbide; Substrates; Thermal conductivity;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2007.4286537
  • Filename
    4286537