Issues in Assembly Process of Next-Generation Fine-Pitch Chip-On-Flex Packages for LCD Applications

Author

Jang, Changsoo ; Han, Seongyoung ; Ryu, Jaychul ; Cho, Seungmin ; Kim, Hangyu

Author_Institution

Semicond. Mater. R&D Center, Samsung Techwin Corp., Ltd, Gyunggi-Do

Volume

30

Issue

1

fYear

2007

Firstpage

2

Lastpage

10

Abstract

Some of the current assembly issues of fine-pitch chip-on-flex (COF) packages for LCD applications are reviewed. Traditional underfill material, anisotropic conductive adhesive (ACA), and nonconductive adhesive (NCA) are considered in conjunction with two applicable bonding methods including thermal and laser bonding. Advantages and disadvantages of each material/process combination are identified. Their applicability is further investigated to identify a process most suitable to the next-generation fine-pitch packages (less than 35 mum). Numerical results and subsequent testing results indicate that the NCA/laser bonding process is advantageous for preventing both lead crack and excessive misalignment compared to the conventional bonding process

Keywords

adhesive bonding; assembling; chip scale packaging; conductive adhesives; fine-pitch technology; liquid crystal displays; LCD; anisotropic conductive adhesive; assembly process; bonding methods; bump joint; chip-on-flex packages; fine-pitch packages; laser bonding; liquid crystal display; next-generation packages; nonconductive adhesive; nonflow underfill; thermal bonding; Anisotropic magnetoresistance; Assembly; Bonding processes; Conducting materials; Conductive adhesives; Nonconductive adhesives; Optical materials; Packaging; Testing; Thermal conductivity; Assembly; bump joint; fine-pitch chip-on-flex package; nonflow underfill;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2006.890202

Filename

4084591