Silicon Bench for Passive Coupling and Packaging of High-Frequency Optoelectronic Devices

Author

Yang, H. ; Zhu, H.L. ; Xie, H.Y. ; Zhao, L.J. ; Zhou, F. ; Wang, W.

Author_Institution

Inst. of Semicond., Acad. Sinica, Beijing

Volume

30

Issue

1

fYear

2007

Firstpage

34

Lastpage

37

Abstract

Coupling and packaging have become decisive factors in the final performance and cost of high-frequency optoelectronic devices. Here, we report the design and successful fabrication of a silicon bench that integrates a V-groove and high-frequency coplanar waveguide (CPW) on the same high-resistivity silicon wafer as an effective optoelectronic packaging solution

Keywords

coplanar waveguides; integrated optoelectronics; semiconductor device packaging; silicon; CPW; Si; V-groove; high-frequency coplanar waveguide; high-frequency optoelectronic devices; high-resistivity silicon wafer; optoelectronic packaging; passive coupling; silicon bench; Coplanar waveguides; Costs; Coupling circuits; Electromagnetic heating; Microwave devices; Optical device fabrication; Optical waveguides; Optoelectronic devices; Packaging; Silicon; Coplanar waveguide (CPW); V-groove; high-frequency; low microwave loss; optoelectronic packaging; passive coupling; silicon bench;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2006.890214

Filename

4084606