• DocumentCode
    1087977
  • Title

    Emergent faces in crystal etching

  • Author

    Hubbard, Ted J. ; Antonsson, Erik K.

  • Author_Institution
    Div. of Eng. & Appl. Sci., California Inst. of Technol., Pasadena, CA, USA
  • Volume
    3
  • Issue
    1
  • fYear
    1994
  • fDate
    3/1/1994 12:00:00 AM
  • Firstpage
    19
  • Lastpage
    28
  • Abstract
    The time development of emergent faces in crystal etching is investigated. We present and discuss a novel computational approach, based on an intuitive geometrical derivation, for predicting an etched shape given an initial polygonal (mask) shape and a diagram of etch rate as a function of orientation. A two-dimensional geometric model is derived which determines the etched shape as a function of time. The model is both intuitive and easy to implement manually or by computer. Because the model is intuitive in nature, some results can be obtained from only partial information. In addition, the model is a first step in the transition from analysis to design. Rather than predicting the etched shape for a given original shape, often what is desired is the original mask shape needed to produce a particular etched shape. This inversion process is carried out for some special cases. The concepts of equilibrium or eigen shapes (Eshapes), limit shapes, and time scaling are introduced. Model predictions are compared with experimental results. The extension from two dimensions to three is also introduced
  • Keywords
    eigenvalues and eigenfunctions; etching; micromechanical devices; semiconductor device models; semiconductor process modelling; semiconductor technology; Eshapes; MEMS design; MEMS fabrication; computational approach; crystal etching; eigen shapes; emergent faces; equilibrium; etch rate; etched shape; geometric model; initial polygonal mask shape; intuitive geometrical derivation; limit shapes; microelctromechanical systems; micromechanicalelctrical systems; orientation; original mask shape; partial information; time development; time scaling; Anisotropic magnetoresistance; Crystallization; Design engineering; Design methodology; Etching; Fabrication; Micromechanical devices; Shape; Silicon; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/84.285721
  • Filename
    285721