• DocumentCode
    1088655
  • Title

    An advanced SVG technology for 64K junction-shorting PROM´s

  • Author

    Fukushima, Toshitaka ; Ueno, Kouji ; Tanaka, Kazuo

  • Author_Institution
    Fujitsu, Ltd., Kawasaki, Japan
  • Volume
    30
  • Issue
    12
  • fYear
    1983
  • fDate
    12/1/1983 12:00:00 AM
  • Firstpage
    1785
  • Lastpage
    1791
  • Abstract
    The memory cell size of the 64 kbit PROM was reduced to 168µm2(0.26 mil2) by using advanced SVG (Shallow V-Groove) isolation and the wafer stepper process. SVG isolation was introduced in 1979 to suppress the SCR latching between two neighboring cells in the 4 kbit junction-shorting PROM. Since then, the cell size has been reduced until it became limited by the widths of word and bit lines. In the 64 kbit PROM, the SVG isolation technology was improved to achieve self-alignment in diffusion, to provide a high breakdown voltage for Schottky diodes, and to increase the flexibility of the mask layout. The size of the peripheral circuitry was thus reduced to allow a smaller cell size and a smaller parasitic capacitance. The memory cell array occupies 45.0 percent of the total die size of 7.14 × 5.28 mm2.
  • Keywords
    Circuits; Epitaxial layers; Etching; Fabrication; Isolation technology; PROM; Schottky diodes; Silicon; Substrates; Thyristors;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1983.21446
  • Filename
    1483347