DocumentCode :
1088655
Title :
An advanced SVG technology for 64K junction-shorting PROM´s
Author :
Fukushima, Toshitaka ; Ueno, Kouji ; Tanaka, Kazuo
Author_Institution :
Fujitsu, Ltd., Kawasaki, Japan
Volume :
30
Issue :
12
fYear :
1983
fDate :
12/1/1983 12:00:00 AM
Firstpage :
1785
Lastpage :
1791
Abstract :
The memory cell size of the 64 kbit PROM was reduced to 168µm2(0.26 mil2) by using advanced SVG (Shallow V-Groove) isolation and the wafer stepper process. SVG isolation was introduced in 1979 to suppress the SCR latching between two neighboring cells in the 4 kbit junction-shorting PROM. Since then, the cell size has been reduced until it became limited by the widths of word and bit lines. In the 64 kbit PROM, the SVG isolation technology was improved to achieve self-alignment in diffusion, to provide a high breakdown voltage for Schottky diodes, and to increase the flexibility of the mask layout. The size of the peripheral circuitry was thus reduced to allow a smaller cell size and a smaller parasitic capacitance. The memory cell array occupies 45.0 percent of the total die size of 7.14 × 5.28 mm2.
Keywords :
Circuits; Epitaxial layers; Etching; Fabrication; Isolation technology; PROM; Schottky diodes; Silicon; Substrates; Thyristors;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1983.21446
Filename :
1483347
Link To Document :
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