DocumentCode
1088757
Title
Differential scanning calorimetry studies on eutectic (Sn63/Pb37) solder paste and powder for surface mount technology
Author
Tang, A.C.T. ; Sargent, P.M.
Author_Institution
Dept. of Eng., Cambridge Univ., UK
Volume
27
Issue
22
fYear
1991
Firstpage
2018
Lastpage
2020
Abstract
The properties of eutectic solder paste (Sn63/Pb37) in an RMA flux and solder powder have been investigated using differential scanning calorimetry. The results show that the melting point for both the paste and powder samples occurs at 182 degrees C and also the effects of supercooling occurs for both the paste and the powder samples. The supercooling results are of vital importance in the modelling of the thermal processes for electronics manufacture using surface mount technology.
Keywords
calorimetry; lead alloys; soldering; supercooling; surface mount technology; tin alloys; 182 degC; RMA flux; SnPb; differential scanning calorimetry; electronics manufacture; melting point; solder paste; solder powder; supercooling; surface mount technology;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19911250
Filename
132965
Link To Document