• DocumentCode
    1090151
  • Title

    The development of heterojunction integrated injection logic

  • Author

    Yuan, Han-tzong ; Shih, Hung-Dah ; Delaney, Joseph ; Fuller, Clyde

  • Author_Institution
    Texas Instruments Inc., Dallas, TX, USA
  • Volume
    36
  • Issue
    10
  • fYear
    1989
  • fDate
    10/1/1989 12:00:00 AM
  • Firstpage
    2083
  • Lastpage
    2092
  • Abstract
    The development of heterojunction integrated injection logic (HI 2L) since 1982 is described. The baseline process that uses AlGaAs/GaAs emitter-down HBTs (heterojunction bipolar transistors) as the switching element is presented. Two sets of design rules, one using a 7.0-μm collector and 8.0-μm metal pitch and another using a 5.0-μm collector and 5.0-μm metal pitch, have been developed for the pilot line circuit fabrication. Typical propagation delays obtained for a fan-out=4 HI2L gate using the 7.0- and 5.0-μm collector processes are 250 and 150 ps, respectively, at a power dissipation of 5 mW per gate. LSI and VLSI circuits as complex as 4 K-gate arrays and 32-bit MIPS microprocessors have been fabricated successfully using the HI2L technology
  • Keywords
    III-V semiconductors; VLSI; aluminium compounds; bipolar integrated circuits; gallium arsenide; integrated injection logic; integrated logic circuits; logic arrays; 150 ps; 250 ps; 32 bit; 5 mW; AlGaAs-GaAs; LSI; MIPS microprocessors; VLSI; baseline process; collector; design rules; emitter-down HBTs; fan-out; gate arrays; heterojunction integrated injection logic; metal pitch; power dissipation; propagation delays; switching element; Circuits; Fabrication; Gallium arsenide; Heterojunction bipolar transistors; Large scale integration; Logic; Microprocessors; Power dissipation; Propagation delay; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.40889
  • Filename
    40889