DocumentCode
1090218
Title
Transconductance compression in submicrometer GaAs MESFET´s
Author
Chen, C.L. ; Wise, K.D.
Author_Institution
Massachusetts Institute of Technology, Lexington, MA
Volume
4
Issue
10
fYear
1983
fDate
10/1/1983 12:00:00 AM
Firstpage
341
Lastpage
343
Abstract
The transconductance compression phenomenon in GaAs MESFET´s is known to depend on the gate metal, processing, and the gate length. This phenomenon is thought to be caused by the depletion region under the free surface between gate and drain. Based on this assumption, a new model is proposed which is able to explain the experimental results for 0.25-µm gate-length devices satisfactorily.
Keywords
Circuit simulation; Electrons; Gallium arsenide; Laboratories; MESFETs; MOSFET circuits; Microwave devices; Physics; Transconductance; Voltage;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/EDL.1983.25756
Filename
1483500
Link To Document