Title :
p-Channel MOSFET´s in LPCVD PolySilicon
Author :
Malhi, S.D.S. ; Chatterjee, P.K. ; Pinizzotto, R.F. ; Lam, H.W. ; Chen, C.E.C. ; Shichijo, H. ; Shah, R.R. ; Bellavance, D.W.
Author_Institution :
Texas Instruments Incorporated, Dallas, TX
fDate :
10/1/1983 12:00:00 AM
Abstract :
p-channel MOSFET´s have been fabricated in LPCVD polysilicon. A 5000-Å n+poly acts as the gate electrode on which a 500-Å thermal oxide is grown to act as the gate insulator. Then a 1500-Å LPCVD polysilicon layer is deposited at 620°C and is subsequently boron doped to form the conductive channel. Devices with channel length as small as 2 µm show well-behaved transistor characteristics. The drive current and leakage current are as suitable for usage as load element in memory applications. At large gate voltages the accumulation hole mobility is 9 cm2/V.s. The drain-to-source breakdown voltage exceeds -20 V.
Keywords :
Boron; CMOS technology; Electrodes; Insulation; Leakage current; MOSFETs; Resistors; Silicon; Testing; Voltage;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/EDL.1983.25767