DocumentCode
1090380
Title
Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers
Author
Mishima, H. ; Ohmi, T. ; Mizuniwa, T. ; Abe, M.
Author_Institution
Tokyama Soda Co. Ltd., Yamaguchi, Japan
Volume
2
Issue
4
fYear
1989
fDate
11/1/1989 12:00:00 AM
Firstpage
121
Lastpage
129
Abstract
In order to estimate the cleanliness of wafer surfaces cleaned and dried with various procedures, the outgassing from these wafer surfaces was analyzed by highly sensitive atmospheric pressure ionization mass spectrometry (APIMS). In particular, the desorption of isopropanol (IPA) and moisture from wafers after IPA vapor drying was investigated by introducing the desorbed gases from wafer surfaces into APIMS. It is shown that desorbed trace impurities, the amounts of which are as small as 1/10 of a monomolecular layer of adsorption, were qualitatively and quantitatively detectable under these experimental conditions. As a result, it was confirmed that the desorption behavior is influenced by the surface condition of the wafers, caused by the wet chemical processes and the drying methods
Keywords
desorption; drying; elemental semiconductors; mass spectra; moisture; organic compounds; semiconductor technology; silicon; spectra of organic molecules and substances; surface treatment; APIMS; IPA vapour dried wafers; Si; atmospheric pressure ionization mass spectrometry; desorption behavior; isopropanol; moisture; outgassing; semiconductor wafer surface cleanliness; surface condition; Chemical analysis; Chemical processes; Gases; Impurities; Ionization; Mass spectroscopy; Moisture; Silicon; Surface contamination; Ultra large scale integration;
fLanguage
English
Journal_Title
Semiconductor Manufacturing, IEEE Transactions on
Publisher
ieee
ISSN
0894-6507
Type
jour
DOI
10.1109/66.44615
Filename
44615
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