DocumentCode :
1090380
Title :
Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers
Author :
Mishima, H. ; Ohmi, T. ; Mizuniwa, T. ; Abe, M.
Author_Institution :
Tokyama Soda Co. Ltd., Yamaguchi, Japan
Volume :
2
Issue :
4
fYear :
1989
fDate :
11/1/1989 12:00:00 AM
Firstpage :
121
Lastpage :
129
Abstract :
In order to estimate the cleanliness of wafer surfaces cleaned and dried with various procedures, the outgassing from these wafer surfaces was analyzed by highly sensitive atmospheric pressure ionization mass spectrometry (APIMS). In particular, the desorption of isopropanol (IPA) and moisture from wafers after IPA vapor drying was investigated by introducing the desorbed gases from wafer surfaces into APIMS. It is shown that desorbed trace impurities, the amounts of which are as small as 1/10 of a monomolecular layer of adsorption, were qualitatively and quantitatively detectable under these experimental conditions. As a result, it was confirmed that the desorption behavior is influenced by the surface condition of the wafers, caused by the wet chemical processes and the drying methods
Keywords :
desorption; drying; elemental semiconductors; mass spectra; moisture; organic compounds; semiconductor technology; silicon; spectra of organic molecules and substances; surface treatment; APIMS; IPA vapour dried wafers; Si; atmospheric pressure ionization mass spectrometry; desorption behavior; isopropanol; moisture; outgassing; semiconductor wafer surface cleanliness; surface condition; Chemical analysis; Chemical processes; Gases; Impurities; Ionization; Mass spectroscopy; Moisture; Silicon; Surface contamination; Ultra large scale integration;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.44615
Filename :
44615
Link To Document :
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