• DocumentCode
    1090380
  • Title

    Desorption characteristics of isopropanol (IPA) and moisture from IPA vapor dried silicon wafers

  • Author

    Mishima, H. ; Ohmi, T. ; Mizuniwa, T. ; Abe, M.

  • Author_Institution
    Tokyama Soda Co. Ltd., Yamaguchi, Japan
  • Volume
    2
  • Issue
    4
  • fYear
    1989
  • fDate
    11/1/1989 12:00:00 AM
  • Firstpage
    121
  • Lastpage
    129
  • Abstract
    In order to estimate the cleanliness of wafer surfaces cleaned and dried with various procedures, the outgassing from these wafer surfaces was analyzed by highly sensitive atmospheric pressure ionization mass spectrometry (APIMS). In particular, the desorption of isopropanol (IPA) and moisture from wafers after IPA vapor drying was investigated by introducing the desorbed gases from wafer surfaces into APIMS. It is shown that desorbed trace impurities, the amounts of which are as small as 1/10 of a monomolecular layer of adsorption, were qualitatively and quantitatively detectable under these experimental conditions. As a result, it was confirmed that the desorption behavior is influenced by the surface condition of the wafers, caused by the wet chemical processes and the drying methods
  • Keywords
    desorption; drying; elemental semiconductors; mass spectra; moisture; organic compounds; semiconductor technology; silicon; spectra of organic molecules and substances; surface treatment; APIMS; IPA vapour dried wafers; Si; atmospheric pressure ionization mass spectrometry; desorption behavior; isopropanol; moisture; outgassing; semiconductor wafer surface cleanliness; surface condition; Chemical analysis; Chemical processes; Gases; Impurities; Ionization; Mass spectroscopy; Moisture; Silicon; Surface contamination; Ultra large scale integration;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.44615
  • Filename
    44615