DocumentCode :
1091151
Title :
Temperature Control and In Situ Fault Detection of Wafer Warpage
Author :
Ho, Weng Khuen ; Yap, Christopher ; Tay, Arthur ; Chen, Wei ; Zhou, Ying ; Tan, Woei Wan ; Chen, Ming
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore
Volume :
20
Issue :
1
fYear :
2007
Firstpage :
1
Lastpage :
4
Abstract :
Warped wafers can affect device performance, reliability, and linewidth control in various processing steps. We propose in this paper an in situ fault detection technique for wafer warpage in lithography. The use of advanced process control results in very small temperature disturbance making it suitable for industrial implementation
Keywords :
fault diagnosis; integrated circuit manufacture; lithography; process control; signal detection; temperature control; fault detection; lithography; process control; temperature control; wafer warpage; Air gaps; Computational modeling; Computer simulation; Feedback control; Industrial control; Linear programming; Optimal control; Pi control; Semiconductor device modeling; Temperature control; Fault detection; lithography; temperature measurement; wafer warpage;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2006.890314
Filename :
4089019
Link To Document :
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