• DocumentCode
    1091462
  • Title

    Development of an electrostatically bonded fiber optic connection technique

  • Author

    Spitzer, Mark B. ; Younger, Peter R. ; Allard, Frederick C. ; Olin, Lester D.

  • Author_Institution
    Spire Corporation, Bedford, MA, USA
  • Volume
    18
  • Issue
    10
  • fYear
    1982
  • fDate
    10/1/1982 12:00:00 AM
  • Firstpage
    1584
  • Lastpage
    1588
  • Abstract
    This paper describes the development and fabrication of prototype multichannel fiber optic connector subassemblies. The design is based on state-of-the-art fabrication techniques which use anisotropic silicon etching and electrostatic bonding. The advantages of these techniques, as well as the manner in which they are employed in a fabrication sequence, are discussed in detail It is shown that accurate fiber positioning in a two-dimensional array can be achieved without stringent control of fiber diameter. Results of fabrication of prototypes are presented.
  • Keywords
    Electrostatic processes; Optical fiber connecting; Semiconductor device bonding; Silicon materials/devices; Anisotropic magnetoresistance; Bonding; Connectors; Electrostatics; Etching; Optical device fabrication; Optical fiber cables; Optical fibers; Prototypes; Silicon;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/JQE.1982.1071414
  • Filename
    1071414