DocumentCode :
109204
Title :
Spike Anneal Peak Temperature Impact on 1T-DRAM Retention Time
Author :
Nissimoff, Albert ; Martino, Joao Antonio ; Aoulaiche, Marc ; Veloso, A. ; Witters, Liesbeth Johanna ; Simoen, Eddy ; Claeys, Cor
Author_Institution :
Electron. Syst. Dept., Univ. of Sao Paulo, São Paulo, Brazil
Volume :
35
Issue :
6
fYear :
2014
fDate :
Jun-14
Firstpage :
639
Lastpage :
641
Abstract :
This letter reports on the spike anneal temperature influence on the retention time of 1T-dynamic random access memory cells using a single silicon-on-insulator transistor on ultrathin buried oxide wafers. A 20 °C temperature difference (from 1070 °C to 1050 °C) in the peak process temperature during the spike anneal after the source/drain implantation caused an order of magnitude increment in the retention time. The lower temperature analyzed (1050 °C) increases the retention time up to 100 ms because of the lower drain electrical field and tunneling current.
Keywords :
DRAM chips; annealing; silicon-on-insulator; 1T-DRAM retention time; SOI; drain electrical field; drain implantation; dynamic random access memory cells; single silicon-on-insulator transistor; source implantation; spike anneal peak temperature; temperature 1070 degC to 1050 degC; temperature 20 degC; tunneling current; Annealing; Logic gates; Mathematical model; Random access memory; Time measurement; Transistors; Tunneling; 1T-DRAM; 1T-DRAM.; Capacitorless DRAM; SOI;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2014.2319094
Filename :
6811203
Link To Document :
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