• DocumentCode
    1092117
  • Title

    Laser ablation as a processing technique for metallic and polymer layered structures

  • Author

    Guzzo, Edward E. ; Preston, John S.

  • Author_Institution
    Dept. of Eng. Phys., McMaster Univ., Hamilton, Ont., Canada
  • Volume
    7
  • Issue
    1
  • fYear
    1994
  • fDate
    2/1/1994 12:00:00 AM
  • Firstpage
    73
  • Lastpage
    78
  • Abstract
    A study of the laser ablation process for application in processing metallic and polymer layered structures is presented. The central result of this study is that, by operating with laser pulses of different fluences, it is possible to selectively remove polymer overlayers on metallic films and metallic films from polymer layers, provided the metallic films are sufficiently thin. Careful choice of the fluence allowed both of these processes to be carried out with minimal damage to the underlying material. The damage produced has been characterized by laser processing through visual inspection, profilometry, and electron microscopy. In the case of polymer layers, the effect of exposure to laser irradiation through spectroscopic studies in the infrared, visible, and ultraviolet portion of the spectrum has also been studied. For the metallic layers, we have correlated the visible damage observed with changes in the electrical resistivity of the films
  • Keywords
    inspection; laser ablation; metallic thin films; polymer films; semiconductor technology; electrical resistivity; electron microscopy; laser ablation; laser processing; laser pulse fluence; metallic layered structures; polymer layered structures; processing technique; profilometry; spectroscopic studies; visual inspection; Heating; Laser ablation; Laser applications; Laser theory; Optical materials; Optical pulses; Polymer films; Power engineering and energy; Pulsed laser deposition; Resists;
  • fLanguage
    English
  • Journal_Title
    Semiconductor Manufacturing, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0894-6507
  • Type

    jour

  • DOI
    10.1109/66.286834
  • Filename
    286834