DocumentCode :
1092140
Title :
In situ semiconductor materials characterization by emission Fourier transform infrared spectroscopy
Author :
Zhou, Zhen-Hong ; Compton, Senja ; Yang, Isabel ; Reif, Rafael
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., MIT, Cambridge, MA, USA
Volume :
7
Issue :
1
fYear :
1994
fDate :
2/1/1994 12:00:00 AM
Firstpage :
87
Lastpage :
91
Abstract :
The results of a novel emission Fourier transform infrared (E/FT-IR) spectrometer for in-situ characterization of semiconductor materials is presented. For the experiments, the wafers were heated and the infrared emission profiles from the substrates were collected by a standard FT-IR spectrometer. Differences in the emission spectra from different substrates are explained through correlation to the optical properties of the corresponding substrates. The in-situ infrared emission spectrum of a lightly doped (10-20 Ω·cm) silicon wafer at 200°C is very similar to its ex-situ transmission spectrum at room temperature, although the spectrum is inverted. This similarity makes possible the analysis of E/FT-IR spectra by using existing spectral libraries. Finally, it is shown that the E/FT-IR technique can be used for noncontact and noninvasive real-time identification and possibly quantification of impurities during silicon oxidation and for real-time epi-film thickness monitoring during silicon epitaxy
Keywords :
Fourier transform spectroscopy; infrared spectroscopy; semiconductor epitaxial layers; semiconductor growth; thickness measurement; 200 degC; E/FT-IR technique; Si; emission Fourier transform infrared spectroscopy; noninvasive real-time identification; optical properties; oxidation; real-time epi-film thickness monitoring; semiconductor materials characterization; spectral libraries; Fourier transforms; Infrared heating; Infrared spectra; Libraries; Semiconductor materials; Silicon; Spectroscopy; Stimulated emission; Substrates; Temperature;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/66.286836
Filename :
286836
Link To Document :
بازگشت