DocumentCode
1092739
Title
Breakdowns in Si JFET´s
Author
Sakai, Tatsuo ; Sakina, Yasuaki ; Hane, Kunio ; Suzuk, Tokio
Author_Institution
Keio University, Yokohama, Japan
Volume
31
Issue
7
fYear
1984
fDate
7/1/1984 12:00:00 AM
Firstpage
873
Lastpage
879
Abstract
A two-dimensional numerical analysis to clarify the breakdown phenomena in Si n-type JFET is described. In this analysis, the continuity equation for minority carriers is introduced to consider the effect of avalanche multiplication. The heat conduction equation is also taken into account to include the thermal effect on the breakdown voltage. The results obtained are: 1) the mechanisms of excess gate current (EGC), current-mode second breakdown (CSB), and thermal-mode second breakdown (TSB). 2) The effects of how channel impurity concentration Nc , drain current ID , and applied drain voltage VDG affect EGC, CSB, and TSB are also reported.
Keywords
Breakdown voltage; Charge carrier processes; Degradation; Delay effects; Electric breakdown; Electron mobility; Impedance; Impurities; Poisson equations; Thermal conductivity;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1984.21624
Filename
1483909
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