• DocumentCode
    1093092
  • Title

    Understanding the Thermal Implications of Multi-Core Architectures

  • Author

    Chaparro, Pedro ; Gonzalez, Jose ; Magklis, Grigorios ; Cai, Qiong ; Gonzalez, Adriana

  • Author_Institution
    UPC, Barcelona
  • Volume
    18
  • Issue
    8
  • fYear
    2007
  • Firstpage
    1055
  • Lastpage
    1065
  • Abstract
    Multicore architectures are becoming the main design paradigm for current and future processors. The main reason is that multicore designs provide an effective way of overcoming instruction-level parallelism (ILP) limitations by exploiting thread-level parallelism (TLP). In addition, it is a power and complexity-effective way of taking advantage of the huge number of transistors that can be integrated on a chip. On the other hand, today´s higher than ever power densities have made temperature one of the main limitations of microprocessor evolution. Thermal management in multicore architectures is a fairly new area. Some works have addressed dynamic thermal management in bi/quad-core architectures. This work provides insight and explores different alternatives for thermal management in multicore architectures with 16 cores. Schemes employing both energy reduction and activity migration are explored and improvements for thread migration schemes are proposed.
  • Keywords
    microprocessor chips; parallel architectures; power aware computing; thermal management (packaging); bi/quad-core architectures; dynamic thermal management; instruction-level parallelism; microprocessor evolution; multicore architectures; thread-level parallelism; Computer architecture; Degradation; Dynamic voltage scaling; Frequency; Microprocessors; Multicore processing; Parallel processing; Temperature control; Thermal management; Yarn; Activity Migration; Dynamic Thermal Management; Dynamic Voltage; Frequency Scaling; Multi-Core Architectures;
  • fLanguage
    English
  • Journal_Title
    Parallel and Distributed Systems, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1045-9219
  • Type

    jour

  • DOI
    10.1109/TPDS.2007.1092
  • Filename
    4288104