• DocumentCode
    1093410
  • Title

    Large-Scale Cost-Effective Packaging

  • Author

    Farrell, James J., III

  • Author_Institution
    Motorola, Inc.
  • Volume
    5
  • Issue
    3
  • fYear
    1985
  • fDate
    6/1/1985 12:00:00 AM
  • Firstpage
    5
  • Lastpage
    10
  • Abstract
    VLSI circuits challenge traditional electronic packaging methods. Several new package types, however, efficiently handle high-I/O devices.
  • Keywords
    Ceramics; Costs; Electronics industry; Electronics packaging; Integrated circuit packaging; Large-scale systems; Lead; Lifting equipment; Plastic packaging; Transistors;
  • fLanguage
    English
  • Journal_Title
    Micro, IEEE
  • Publisher
    ieee
  • ISSN
    0272-1732
  • Type

    jour

  • DOI
    10.1109/MM.1985.304559
  • Filename
    4089420
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1093410