DocumentCode :
1093410
Title :
Large-Scale Cost-Effective Packaging
Author :
Farrell, James J., III
Author_Institution :
Motorola, Inc.
Volume :
5
Issue :
3
fYear :
1985
fDate :
6/1/1985 12:00:00 AM
Firstpage :
5
Lastpage :
10
Abstract :
VLSI circuits challenge traditional electronic packaging methods. Several new package types, however, efficiently handle high-I/O devices.
Keywords :
Ceramics; Costs; Electronics industry; Electronics packaging; Integrated circuit packaging; Large-scale systems; Lead; Lifting equipment; Plastic packaging; Transistors;
fLanguage :
English
Journal_Title :
Micro, IEEE
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.1985.304559
Filename :
4089420
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1093410
