DocumentCode
1093679
Title
High-temperature physical effects underlying the failure mechanism in thyristors under surge conditions
Author
Silard, Andrei P.
Author_Institution
Polytechnic Institute, Bucharest, Romania
Volume
31
Issue
9
fYear
1984
fDate
9/1/1984 12:00:00 AM
Firstpage
1334
Lastpage
1340
Abstract
With the aim of assessing the role of various high-temperature physical effects in the transient electrothermal behavior of thyristors under surge current conditions, the distribution of carriers concentration in the bases of a thyristor at temperatures close to the threshold of the device destruction has been estimated in a quasi-static approach. It was found that the carriers concentration in almost the entire bases region is well below the level when the Auger recombination and carrier-carrier scattering are important. It is shown that the drastic fall of mobilities µ at elevated temperatures T is responsible for the removal of both Auger recombination and carrier-carrier scattering from the bases of devices. Becoming the dominant factor regulating the carriers dynamics in the bases, it is precisely the dependence
which renders important the contribution of intrinsic carriers in the inhomogenous supply of bases with mobile carriers under strong power dissipation. These high-temperature physical aspects axe incorporated into an unitary presentation of phenomenology of thyristors failure under surge current conditions. The theoretical/experimental background confirming the validity of the failure model presented herein is also outlined in this work. It is shown that the advanced model allows for a computer-based prediction of the transient electrothermal behavior of power thyristors under various surge ratings.
which renders important the contribution of intrinsic carriers in the inhomogenous supply of bases with mobile carriers under strong power dissipation. These high-temperature physical aspects axe incorporated into an unitary presentation of phenomenology of thyristors failure under surge current conditions. The theoretical/experimental background confirming the validity of the failure model presented herein is also outlined in this work. It is shown that the advanced model allows for a computer-based prediction of the transient electrothermal behavior of power thyristors under various surge ratings.Keywords
Aluminum; Electrothermal effects; Failure analysis; Ion implantation; Packaging; Silicides; Silicon; Surges; Temperature; Thyristors;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/T-ED.1984.21709
Filename
1483994
Link To Document