• DocumentCode
    1093679
  • Title

    High-temperature physical effects underlying the failure mechanism in thyristors under surge conditions

  • Author

    Silard, Andrei P.

  • Author_Institution
    Polytechnic Institute, Bucharest, Romania
  • Volume
    31
  • Issue
    9
  • fYear
    1984
  • fDate
    9/1/1984 12:00:00 AM
  • Firstpage
    1334
  • Lastpage
    1340
  • Abstract
    With the aim of assessing the role of various high-temperature physical effects in the transient electrothermal behavior of thyristors under surge current conditions, the distribution of carriers concentration in the bases of a thyristor at temperatures close to the threshold of the device destruction has been estimated in a quasi-static approach. It was found that the carriers concentration in almost the entire bases region is well below the level when the Auger recombination and carrier-carrier scattering are important. It is shown that the drastic fall of mobilities µ at elevated temperatures T is responsible for the removal of both Auger recombination and carrier-carrier scattering from the bases of devices. Becoming the dominant factor regulating the carriers dynamics in the bases, it is precisely the dependence \\mu = f(T) which renders important the contribution of intrinsic carriers in the inhomogenous supply of bases with mobile carriers under strong power dissipation. These high-temperature physical aspects axe incorporated into an unitary presentation of phenomenology of thyristors failure under surge current conditions. The theoretical/experimental background confirming the validity of the failure model presented herein is also outlined in this work. It is shown that the advanced model allows for a computer-based prediction of the transient electrothermal behavior of power thyristors under various surge ratings.
  • Keywords
    Aluminum; Electrothermal effects; Failure analysis; Ion implantation; Packaging; Silicides; Silicon; Surges; Temperature; Thyristors;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1984.21709
  • Filename
    1483994