DocumentCode :
1093679
Title :
High-temperature physical effects underlying the failure mechanism in thyristors under surge conditions
Author :
Silard, Andrei P.
Author_Institution :
Polytechnic Institute, Bucharest, Romania
Volume :
31
Issue :
9
fYear :
1984
fDate :
9/1/1984 12:00:00 AM
Firstpage :
1334
Lastpage :
1340
Abstract :
With the aim of assessing the role of various high-temperature physical effects in the transient electrothermal behavior of thyristors under surge current conditions, the distribution of carriers concentration in the bases of a thyristor at temperatures close to the threshold of the device destruction has been estimated in a quasi-static approach. It was found that the carriers concentration in almost the entire bases region is well below the level when the Auger recombination and carrier-carrier scattering are important. It is shown that the drastic fall of mobilities µ at elevated temperatures T is responsible for the removal of both Auger recombination and carrier-carrier scattering from the bases of devices. Becoming the dominant factor regulating the carriers dynamics in the bases, it is precisely the dependence \\mu = f(T) which renders important the contribution of intrinsic carriers in the inhomogenous supply of bases with mobile carriers under strong power dissipation. These high-temperature physical aspects axe incorporated into an unitary presentation of phenomenology of thyristors failure under surge current conditions. The theoretical/experimental background confirming the validity of the failure model presented herein is also outlined in this work. It is shown that the advanced model allows for a computer-based prediction of the transient electrothermal behavior of power thyristors under various surge ratings.
Keywords :
Aluminum; Electrothermal effects; Failure analysis; Ion implantation; Packaging; Silicides; Silicon; Surges; Temperature; Thyristors;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/T-ED.1984.21709
Filename :
1483994
Link To Document :
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